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Brand Name : OEM and ODM
Model Number : SL81106S09
Certification : UL,RoHS, CE
Place of Origin : China
MOQ : 1pc
Price : Negotiable
Payment Terms : T/T, Western Union, MoneyGram,Paypal
Supply Ability : 100000pcs per day
Delivery Time : 5-7 days
Packaging Details : ESD package
MOQ : 1pc
Copper Thickness : 0.2-6.0OZ
Board Thickness : 0.2-6.0mm
Features 1 : Gerber/PCB file needed
Features 2 : 100% E-test
Features 3 : Quality 2 years guarantee
Ultrasonic scalpel PCBA Board Assembly Printed Circuit PCB Board
Files Requested For PCB Assembly Quotation
 ---In order to provide you with the most efficient and accurate quote on manufacturing the requested unit, we ask that you provide us with the following information.
 1. Gerber file,PCB file,Eagle file or CAD file are all acceptable
 2. A detailed bill of materials (BOM)
 3. Clear pictures of PCB or PCBA sample for us
 4. Quantity and delivery required
 5. Test method for PCBA to guarantee 100% good quality products.
 6. Schematics file for PCB design if need to do function test.
 7. A sample if available for better sourcing
 8. CAD files for enclosure manufacturing if required
 9. A complete wiring and assembly drawing showing any special assembly instructions if required
Technical Requirement for PCB Assembly:
1. Professional Surface-mounting and Through-hole soldering Technology
2. Various sizes like 1206,0805,0603,0402,0201 components SMT technology
3. ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4. PCB Assembly With UL,CE,FCC,Rohs Approval
5. Nitrogen gas reflow soldering technology for SMT.
6. High Standard SMT&Solder Assembly Line
7. High density interconnected board placement technology capacity.
Shinelink kinds PCBA Product

 
 94V0 PCBA manufacture Scale capabilities up to
  
 We combine advanced processes with highly skilled resources. Keeping up with the leading advanced technology and management system in One-stop services of PCB assembly
  
 SMT process (RoHs Compliant) Capabilities up to:
  
 1. 0402 Chip Size
 2. 12 mils Integrated Circuit (IC) Pitch
 3. Micro Ball Grid Array (BGA) – Pitch 16 mils
 4. Flip Chip (Controlled Collapse Chip Connection) – Pitch 5 mils
 5. Quad Flat Package (QFP) – Pitch 12 mils
  
 THT(Wave soldering) process (RoHs Compliant) Capabilities up to:
1.Single side wave soldering
2.SMT & THT mixture process

 
  
PCB Assembly Capabilities
  
| Turnkey PCBA | PCB+components sourcing+assembly+package | 
| Assembly details | SMT and Thru-hole, ISO lines | 
| Lead Time | Prototype: 15 work days. Mass order: 20~25 work days | 
| Testing on products | Flying Probe Test, X-ray Inspection, AOI Test, functional test | 
| Quantity | Min quantity: 1pcs. Prototype, small order, mass order, all OK | 
| Files we need | PCB: Gerber files(CAM, PCB, PCBDOC) | 
| Components: Bill of Materials(BOM list) | |
| Assembly: Pick-N-Place file | |
| PCB panel Size | Min size: 0.25*0.25 inches(6*6mm) | 
| Max size: 20*20 inches(500*500mm) | |
| PCB Solder Type | Water Soluble Solder Paste, RoHS lead free | 
| Components details | Passive Down to 0201 size | 
| BGA and VFBGA | |
| Leadless Chip Carriers/CSP | |
| Double-sided SMT Assembly | |
| Fine Pitch to 0.8mils | |
| BGA Repair and Reball | |
| Part Removal and Replacement | |
| Component package | Cut Tape,Tube,Reels,Loose Parts | 
| PCB assembly | Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing | 
 
  
 PCBA Picture
  
 

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